The Army Research Laboratory
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Aerosol Deposition and Interfacial Study of Multim, Austin, TX
at The Army Research Laboratory
Title of Research Opportunity: Aerosol Deposition and Interfacial Study of Multimaterial Layers
Additive manufacturing has been identified as a major enabling technology for the modernization of the United States Armed Forces. Currently, most additive technologies can build parts from only one class of materials, such as polymers or metals. Hybrid machines leverage multiple technologies to build parts that consist of several materials and use both additive and subtractive manufacturing processes. This research will be focused on developing new tools to add to these machines in order to produce higher performance materials. Aerosol deposition has the potential to deposit materials and coatings onto substrates that can not be done with commercial techniques.
The selected participant will perform aerosol deposition research toward deliverables; 1) depositing and characterize dense films of ceramics onto metal and polymer substrates, 2) to deposit and characterize alternating layers of ceramic and polymer films, and 3) to study the how the process parameters affect the film properties. The participant will work with an aerosol deposition expert from WMRD and alongside experts from The University of Texas at Austin to study the mechanical properties of aerosol deposited films of metals, ceramics, and polymers and explore how the process parameters affect them.
The participant should be a US citizen, have a B.S. up to Ph.D. degree in Materials Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Science, or similar technical area. The participant should have knowledge of mechanical properties of materials, materials processing, and additive manufacturing. The research will be carried out mostly at the Army Research Laboratory South location at The University of Texas in Austin, TX.
Keywords: AEROSOL DEPOSITION, LAYERED COMPOSITES, ADDITIVE MANUFACTURING, MATERIALS CHARACTERIZATION, DIRECT WRITE